System and method for service life management by reusing thermal energy

ABSTRACT

An information handling system includes a computing device, the information handling system includes a computing component of the computing device that is housed in a chassis; and a heating component that increases a temperature of a portion of an airflow when the heating component is in an active state, the portion of the airflow thermally manages the computing component by reducing a temperature of the computing component. The airflow is received by the chassis via an air receiving exchange, and exhausted by the chassis via an air expelling exchange.

BACKGROUND

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system (IHS) generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

Use cases for information handling systems are causing progressivelylarger number of information handling systems to be disposed near eachother. For example, rack mount systems utilize a rack structure to stacktwo or more chassis in an information handling system. Due to thechanging uses of information handling systems, chassis therein may bemodular allowing for continual partial upgrades to the informationhandling system. That is, an information handling system may be composedof multiple chassis that may be attached to each other to form theinformation handling systems. When the multiple chassis are attached,components of the information handling system disposed in each of thechassis may become operably connected to each other.

SUMMARY

In one aspect, an information handling system in accordance with one ormore embodiments of the invention includes a computing device, theinformation handling system includes a computing component of thecomputing device that is housed in a chassis; and a heating componentthat increases a temperature of a portion of an airflow when the heatingcomponent is in an active state, the portion of the airflow thermallymanages the computing component by reducing a temperature of thecomputing component. The airflow is received by the chassis via an airreceiving exchange, and exhausted by the chassis via an air expellingexchange.

In one aspect, a method for environmentally managing an informationhandling system that includes a computing device in accordance with oneor more embodiments of the invention includes thermally managing, usinga portion of an airflow, a computing component of the computing devicethat is housed in a chassis by reducing a temperature of the computingcomponent; and while thermally managing the computing component, heatingthe portion of the airflow using a heating component that it is in anactive state to increase a temperature of the airflow. The portion ofthe airflow is received by the chassis via an air receiving exchange andexhausted by the chassis via an air expelling exchange.

In one aspect, a non-transitory computer readable medium includescomputer readable program code, which when executed by a computerprocessor enables the computer processor to perform a method forenvironmentally managing an information handling system comprising acomputing device, the method in accordance with one or more embodimentsof the invention includes thermally managing, using a portion of anairflow, a computing component of the computing device that is housed ina chassis by reducing a temperature of the computing component; andwhile thermally managing the computing component, heating the portion ofthe airflow using a heating component that it is in an active state toincrease a temperature of the airflow. The portion of the airflow isreceived by the chassis via an air receiving exchange and exhausted bythe chassis via an air expelling exchange.

Other aspects of the invention will be apparent from the followingdescription and the appended claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1.1 shows a diagram of an information handling system in accordancewith one or more embodiments of the invention.

FIG. 1.2 shows a diagram of a building that includes informationhandling systems in accordance with one or more embodiments of theinvention.

FIG. 1.3 shows a diagram of a chassis of an information handling systemsin accordance with one or more embodiments of the invention.

FIG. 1.4 shows a side view of an information handling system inaccordance with one or more embodiments of the invention.

FIG. 1.5 shows a top view diagram of a chassis that includes corrosionmanagement components in accordance with one or more embodiments of theinvention.

FIG. 1.6 shows a top view diagram of a chassis that includes firstairflow management in accordance with one or more embodiments of theinvention.

FIG. 1.7 shows a top view diagram of a chassis that includes secondairflow management in accordance with one or more embodiments of theinvention.

FIG. 2 shows a diagram of an environmental manager of an informationhandling system in accordance with one or more embodiments of theinvention.

FIG. 3 shows a flowchart of a method of managing corrosion states inaccordance with one or more embodiments of the invention.

FIG. 4 shows a diagram of a computing device in accordance with one ormore embodiments of the invention.

DETAILED DESCRIPTION

Specific embodiments will now be described with reference to theaccompanying figures. In the following description, numerous details areset forth as examples of the invention. It will be understood by thoseskilled in the art that one or more embodiments of the present inventionmay be practiced without these specific details and that numerousvariations or modifications may be possible without departing from thescope of the invention. Certain details known to those of ordinary skillin the art are omitted to avoid obscuring the description.

In the following description of the figures, any component describedwith regard to a figure, in various embodiments of the invention, may beequivalent to one or more like-named components described with regard toany other figure. For brevity, descriptions of these components will notbe repeated with regard to each figure. Thus, each and every embodimentof the components of each figure is incorporated by reference andassumed to be optionally present within every other figure having one ormore like-named components. Additionally, in accordance with variousembodiments of the invention, any description of the components of afigure is to be interpreted as an optional embodiment, which may beimplemented in addition to, in conjunction with, or in place of theembodiments described with regard to a corresponding like-namedcomponent in any other figure.

In general, embodiments of the invention relate to systems, devices, andmethods for managing components of an information handling system. Aninformation handling system may be a system that provides computerimplemented services. These services may include, for example, databaseservices, electronic communication services, data storage services, etc.

To provide these services, the information handling system may includeone or more computing devices. The computing devices may include anynumber of computing components that facilitate providing of the servicesof the information handling system. The computing components mayinclude, for example, processors, memory modules, circuit cards thatinterconnect these components, etc.

During operation, these components may generate heat and require gasflows to maintain the temperatures of these components within nominalranges. However, these gases may cause corrosion. The corrosion maydamage the corroded components. The damage may cause the components tofail and/or cause information handling system utilizing the componentsto fail.

Embodiments of the invention may provide methods and systems that managecorrosion. To manage corrosion, a system may reduce the rates at whichcorrosion occurs to prevent premature failures of components due tocorrosion.

To reduce the rates of corrosion, embodiments of the invention maythermally condition gases used for thermal management components. Thethermal conditioning may include heating the gases used to thermallymanagement the components (e.g., processors, circuit cards, memorymodules, other types of components that may be used in computingdevices, etc.). For example, gases used to reduce the temperature of thecomponents as part of thermal management of the components may be heatedbefore being used for thermal management of the components.Consequently, the relative humidity level of the gases may be reducedwhich, in turn, may reduce the rates of corrosion of the componentscaused by the gases.

By doing so, a system in accordance with embodiments of the inventionmay be less likely to prematurely fail or otherwise enter an undesirablecorrosion state due to corrosion by reducing its occurrence, be able toaccept a wider range of gas compositions (e.g., that includecorrosion-inducing species and/or include levels of humidity and are attemperatures that would lead to high rates of corrosion) that may bemore likely to cause corrosion without negatively impacting the system,and/or may be less costly to operate by reducing the necessary level ofconditioning of gases taken into chassis of information handling systemsfor thermal management purposes by conditioning the gases at a granularlevel (e.g., chassis level) rather than at a macro level (e.g., buildinglevel) that may cause conditioned gases to be used to thermally managecomponents that are insensitive to corrosion.

FIG. 1.1 shows an information handling system (10) in accordance withone or more embodiments of the invention. The system may include a frame(110) and any number of chassis (e.g., 100A, 100B, 100C).

As will be discussed in greater detail below, the information handlingsystem (10) may include any number of heating components. A heatingcomponent may be a device that may be used to thermally condition (e.g.,heat) airflows (e.g., a flow of gases) used to thermally managementcomponents of the information handling system. Heating components may beused to thermally condition airflows on an information handling systemlevel, chassis level, and/or other level of granularity (e.g., componentlevel).

To thermally condition gases, the heating components may, for example,(i) generate heat (e.g., using a resistive heating element thatgenerates heat by consuming electricity) used to heat the airflows, (ii)obtain heat generated from other components and use it to heat theairflows, (iii) recirculate airflows that have been heated when used forthermal management of components thereby heating airflows used tothermally manage the components, etc.

An information handling system (e.g., 10) in accordance with one or moreembodiments of the invention may include any number and type of heatingcomponent. The heating components may be used in combination and/orseparately to thermally condition different airflows and/or portions ofthe airflows. For example, different airflows and/or portions ofairflows may be thermally managed by increasing their respectivetemperatures to different levels. By doing so, the airflows may betailored based on the corrosion susceptibility of downstream components(e.g., components that will go through thermal exchange with theairflows after the airflows are thermally conditioned). Consequently,only a limited amount of energy may be used to thermally condition theairflows so that the components thermally managed by the airflowscorrode at rates that are likely to prevent the components fromprematurely failing due to corrosion of the components.

The frame (110) may be a mechanical structure that enables chassis to bepositioned with respect to one another. For example, the frame (110) maybe a rack mount enclosure that enables chassis to be disposed within it.The frame (110) may be implemented as other types of structures adaptedto house, position, orient, and/or otherwise physically, mechanically,electrically, and/or thermally manage chassis (e.g., direct airflows tothe chassis). By managing the chassis, the frame (110) may enablemultiple chassis to be densely packed in space without negativelyimpacting the operation of the information handling system (10).

The frame may include a door (112). The door may include an informationhandling system heater (196.3) that heats (i.e., adds energy to andincreases the temperature of) gases that traverse the informationhandling system heater (196.3) before entering the interior of the frame(110). As will be discussed in greater detail below, the informationhandling system heater (196.3) may reduce the corrosiveness of gasesthat pass through it by increasing the temperature of the gas (reducingthe relative humidity of the gas) and thereby making those gases lesslikely to corrode components that they thermally manage. Consequently,corrosion or other products generated inside of the frame (110) may bereduced by virtue of the reduced corrosiveness of the gases.

A chassis (e.g., 100A) may be a mechanical structure for housingcomponents of an information handling system. For example, a chassis maybe implemented as a rack mountable enclosure for housing components ofan information handling system. The chassis may be adapted to bedisposed within the frame (110) and/or utilize services provided by theframe (110) and/or other devices.

Any number of components may be disposed in each of the respectivechassis (e.g., 100A, 100B, 100C). These components may be portions ofcomputing devices that provide computer implemented services, discussedin greater detail below.

When the components provide computer implemented services, thecomponents may generate heat. For example, the components may utilizeelectrical energy to perform computations and generate heat as abyproduct of performing the computations. If left unchecked, a buildupof heat within a chassis may cause temperatures of the componentsdisposed within the chassis to exceed preferred ranges.

The preferred ranges may include a nominal range in which the componentsrespectively operate: (i) without detriment and/or (ii) are likely to beable to continue to operate through a predetermined service life of acomponent. Consequently, it may be desirable to maintain thetemperatures of the respective components within the preferred range(e.g., a nominal range).

When a component operates outside of the preferred range, the servicelife of the component may be reduced, the component may not be able toperform optimally (e.g., reduced ability to provide computations, higherlikelihood of error introduced into computations, etc.), and/or thecomponent may be more likely to unexpectedly fail. The component may besubject to other undesirable behavior when operating outside of thepreferred range without departing from the invention.

To operate components within the preferred range of temperature, thechassis may include air exchanges (e.g., 102). An air exchange may beone or more openings in an exterior of a chassis that enables thechassis to exchange gases with an ambient environment. For example, achassis may utilize air exchanges to (i) vent hot gases and (ii) intakecool gases. By doing so, the temperature of the gases within the chassismay be reduced. Consequently, the temperatures of components within thechassis may be reduced by utilizing the cooler gases taken into thechassis via an air exchange.

However, utilizing gases to cool components within a chassis may beproblematic. The gases may not be benign, as noted above with respect tothe discussion of the information handling system heater (196.3). Forexample, the gases may be: (i) chemically reactive, (ii) includehumidity, and/or (iii) otherwise interact with portions of the chassisand/or components disposed within the chassis in an undesirable manner.The reaction between the gases used to cool the components, portions ofthe chassis, and the components themselves (or other componentsproximate to the to-be-cooled components) may negatively impact thecomponents disposed within the chassis and/or with the chassis itself

For example, if the gases include a chemically reactive component (e.g.,chlorine species), the gases may react (i.e., chemically react) withportions of the chassis and/or components disposed within the chassis.These reactions may: (i) generate corrosion on the portions of thechassis and/or (ii) generate corrosion on the components disposed withinthe chasses. This corrosion may (a) negatively impact the appearance ofthe chassis, (b) cause corrosion from the chassis to circulate withinthe chassis thereby potentially impacting the operation of componentswithin the chassis, and/or (c) damage portions of the componentsdisposed within the chassis directly resulting in a decreased servicelife of the components.

In another example, if the gases include humidity, the humidity may(under certain conditions) condense resulting in water (even at lowlevels) being disposed on the surfaces of the chassis and/or components.For example, when gases are taken into the chassis via an air exchange(102), water vapor may condense onto the surface of the air exchanger.

When water is disposed on the surface of the chassis and/or components(even at very small levels), the water may chemically react formingcorrosion. The aforementioned reactions with the condensed water maydamage the chassis, generate corrosion products that may circulatethroughout the chassis, and/or damage the components within the chassisor otherwise cause them to operate in an undesirable manner. Compoundingcorrosion due to condensed humidity and chemically reactive species maybe particularly problematic because a condensed layer of water on thecomponents or chassis may preferentially absorb chemically reactivespecies included in gases used for cooling which may amplify thecorrosive impact of the chemically reactive species.

The potential reactions, discussed above, may cause numerous negativeimpacts. First, the reactions may impact the appearance of the chassis.The reaction products may have an unsightly appearance that makes thechassis look impaired to a viewer. Second, the reaction products may notbe fixedly attached thereby resulting in reaction products circulatingthroughout the interior of the chassis. These products may be depositedin unpredictable manners throughout the chassis. When deposited, thereaction products may cause, for example, short circuits, changes inimpedance of circuits, or otherwise impact the ability of othercomponents to perform their functionalities.

Third, the reactions may impact the physical size of various componentsdisposed within the chassis. For example, when metals chemically react,the products formed by the reactions may occupy significantly largervolumes than the unreacted metals (e.g., metal oxides vs elementalmetals). The change in volumes of the reacted metals may negativelyimpact the electrical functionality of the components by, for example,forming open circuits by physically disconnecting various portions ofthe components from each other and/or other devices.

The potential reactions may cause other negative impacts beyond thosediscussed herein. The negative impacts may cause a device to fail priorto meeting its service life. A service life may be a desired duration ofoperation of a component, device, or system.

To address the above and/or other potential issues, embodiments of theinvention may provide methods, devices, and systems that mitigatecorrosion. To mitigate corrosion, heating components includinginformation handling system heaters (e.g., 196.3) may be used. Aninformation handling system heater may be a structure that heats (i.e.,adds energy to and increases the temperature of) gases that makeup theairflow within each chassis (100A, 100B, 100C) in the informationhandling system (10). Specifically, an information handling systemheater may be disposed at an entrance to the information handling systemframe (e.g., information handling system heater (e.g., 196.3)). Such aninformation handling system heater may increase the temperature of theairflow thereby making the airflow have a greater water capacity (andless likely to release moisture) and therefore be less corrosive. Bydoing so, the rates of corrosion of chassis and/or components disposedwithin chassis may be reduced be reducing the amount of water that isdisposed on surfaces due to the gases used to cool the components in thechassis.

If the risk of corrosion is sufficiently high, even when informationhandling system heaters are utilized, the system may automatically takesteps to reduce the risk of corrosion. For example, the system mayschedule activation and deactivation of chassis heaters (or other typesof heating components) or modify environmental conditions within a frameto reduce corrosion.

In one or more embodiments of the invention, an information handlingsystem environmental manager (119) may be a computing device programmedto (i) obtain information regarding the operation of the informationhandling system and/or one or more chassis therein and (ii) set theoperating points of the information handling system heater (196.3). Bydoing so, the information handling system environmental manager (119)may cause the information handling system heater (196.3) to activate andreduce the relative humidity of the airflow entering the informationhandling system (i.e., by increasing the airflow temperature).

To decide how to set the operating points of the information handlingsystem heater, the information handling system environmental manager(119) may obtain and/or be provided information regarding theenvironmental conditions (e.g., temperatures, relative humidity levels,corrosion rates of components) within each of the chassis. For example,the system information system environmental manager (119) may beoperably connected to environmental managers of each of the chassisand/or the information handling system heater (196.3) via anycombination of wired and/or wireless networks. The respectiveenvironmental managers of the chassis may provide such information tothe information handling system environmental manager (119) and/orservice requests regarding the operating points of the informationhandling system heater (196.3) via the operable connections.

The information handling system environmental manager (119) may beimplemented using a computing device. For additional details regardingcomputing devices, refer to FIG. 4. The information handling systemenvironmental manager (119) may perform all, or a portion, of the methodillustrated in FIG. 3 while providing its functionality.

To further clarify the environments in which corrosion may arise, adiagram of an environment in which chassis of IHSs may reside isillustrated in FIG. 1.2 and a diagram of a chassis is provided in FIG.1.3.

Turning to FIG. 1.2, FIG. 1.2 shows a top view diagram of a building(115) in which chassis of IHSs may reside in accordance with one or moreembodiments of the invention. The building (115) may house a data center(e.g., an aggregation of information handling systems) that includes anynumber of information handling systems (e.g., 10A, 10B). The informationhandling systems may include chassis which may need to take in andexhaust gases for temperature regulation purposes due to heat generationby components disposed in the chassis.

To facilitate gas management within the building (115), the informationhandling systems may be organized into rows (or other groupings ofinformation handling systems). In FIG. 1.2, the rows of informationhandling systems extend from top to bottom along the page. To enablegases to be provided to the information handling systems (e.g., fortemperature regulation purposes), an airflow conditioner (120) may bedisposed within the building. The airflow conditioner (120) may providesupply airflow (122) and take in a return airflow (124). These airflowsare illustrated as arrows having dashed tails.

The supply airflow (122) may be at a lower temperature than the returnairflow (124). Consequently, when information handling systems obtainportions of the supply airflow (122), the information handling systemsmay be able to utilize the supply airflow (122) to cool componentsdisposed within the chassis of the information handling systems. Forexample, gases from the supply airflow (122) may be passed by componentsdisposed within chassis of information handling systems that are atelevated temperatures. The gases may be at a lower temperature than thecomponents. Consequently, thermal exchange between the gases and thecomponents may decrease the temperature of the components.

After utilizing the gases from the supply airflow (122), the informationhandling systems may exhaust the gases as the return airflow (124).After being exhausted from the information handling systems, the returnairflow (124) may be obtained by the airflow conditioner (120), cooled,and recirculated as the supply airflow (122).

In addition to cooling the return airflow (124), the airflow conditioner(120) may be capable of obtaining gases from other areas (e.g., outsideof the building), reducing the humidity level of an airflow, and/orotherwise conditioning gases for use by information handling systemsand/or other devices.

To manage the aforementioned process, a system environmental manager(130) may be disposed within the building (115) or at other locations.The system environmental manager (130) may be a computing deviceprogrammed to (i) obtain information regarding the operation of theinformation handling systems and (ii) set the operating points of theairflow conditioner (120). By doing so, the system environmental manager(130) may cause the airflow conditioner (120) to provide gases to theinformation handling systems having a temperature and/or humidity levelthat may better enable the information handling systems to regulatetheir respective environmental conditions within the chassis of therespective information handling systems. However, conditioning thesupply airflow (122) may utilize large amounts of energy.

The airflow conditioner (120) may include functionality to granularly,or at a macro level, modify the temperature and/or humidity level of thesupply airflow (122). Consequently, different information handlingsystems (or groups thereof) may receive different supply airflows (e.g.,122) having different characteristics (e.g., different temperaturesand/or humidity levels, different sources, etc.).

Conditioning the return airflow (124) or gases obtained from outside ofthe building (115) may be costly, consume large amounts of electricity,or may otherwise be undesirable. To reduce these costs, the systemenvironmental manager (130) may set the operating point (e.g., desiredtemperature/humidity levels of different portions of the supply airflow(122)) of the airflow conditioner (120) to only provide the minimumnecessary characteristics required by each of the IHSs so that it meetsis service life goals. By doing so, the cost of providing the supplyairflow (122) having characteristics required to meet the environmentalrequirements of the chassis of the information handling systems may bereduced.

To decide how to set the operating points of the airflow conditioner(120), the system environmental manager (130) may obtain and/or beprovided information regarding the environmental conditions (e.g.,temperatures, relative humidity levels, corrosion rates of components)within each of the chassis. For example, the system environmentalmanager (130) may be operably connected to environmental managers ofeach of the chassis and/or the airflow conditioner (120) via anycombination of wired and/or wireless networks. The respectiveenvironmental managers of the chassis may provide such information tothe system environmental manager (130) and/or service requests regardingthe operating points of the airflow conditioner (120) via the operableconnections.

The system environmental manager (130) may be implemented using acomputing device. For additional details regarding computing devices,refer to FIG. 4. The system environmental manager (130) may perform all,or a portion, of the method illustrated in FIG. 3 while providing itsfunctionality.

Turning to FIG. 1.3, FIG. 1.3 shows a diagram of a chassis (100A) inaccordance with one or more embodiments of the invention. A chassis maybe a portion of an IHS and/or house all, or a portion, of an IHS. Aninformation handling system may include a computing device that providesany number of services (e.g., computing implemented services). Toprovide services, the computing device may utilize computing resourcesprovided by computing components (140). The computing components (140)may include, for example, processors, memory modules, storage devices,special purpose hardware, and/or other types of physical components thatcontribute to the operation of the computing device. For additionaldetails regarding computing devices, refer to FIG. 4.

Because the computing device uses computing components (140) to provideservices, the ability of the computing device to provide services islimited based on the number and/or quantity of computing devices thatmay be disposed within the chassis. For example, by adding additionalprocessors, memory modules, and/or special purpose hardware devices, thecomputing device may be provided with additional computing resourceswhich it may be used to provide services. Consequently, large number ofcomputing components that each, respectively, generate heat may bedisposed within the chassis.

To maintain the temperatures of the computing components (140) (and/orother types of components) within a nominal range, gases may be taken inthrough an air receiving exchange (142). The gases may be passed by thecomputing components (140) to exchange heat with them. The heated gasesmay then be expelled out of an air expelling exchange (144).

However, by taking in and expelling gases used for cooling purposes, theair receiving exchange (142), other portions of the chassis (100A)and/or components disposed within the chassis (100A) may be subject todegradation due to corrosion. For example, as discussed above, the gasesmay include components such as humidity or chemical species that maychemically react forming corrosion. Importantly, the combination ofhumidity that may condense on components and chemically reactive speciesthat may be absorbed into the condensed humidity may be particularlyproblematic.

The chemical reaction products may form corrosion, cause corrosionproducts to circulate in the chassis (and/or outside of the chassis bybeing expelled as part of heated gases), and/or damage the structureand/or change the electrical properties of the computing components(140). These changes may negatively impact the ability of the computingdevice disposed in the chassis (100A) to provide its functionality.

For example, the computing device may have a service life during whichit is expected that the computing device will be likely to provide itsfunctionality. However, changes in the structure and/or electricalproperties of these components due to exposure to humidity and/orchemically reactive specifies of the gases used for temperatureregulation purposes may cause the components to prematurely fail aheadof the service life being met due to corrosion formation, change anappearance of the chassis by virtue of the presence of corrosionproducts, and/or otherwise negatively impact the chassis (100A) and/orcomponents disposed within it.

In general, embodiments of the invention provide methods, devices, andsystems for managing corrosion within chassis. To manage corrosion, asystem in accordance with embodiments of the invention may: (i) modifycorrosive materials to reduce their corrosiveness (e.g., by increasingairflow temperature via a chassis heater (196.4) or other type ofheating component), (ii) monitor the occurrence of corrosion (e.g., acorrosion state), and (iii) based on the monitored corrosion, activateone or more heating component (e.g., an information handling systemheater, a chassis heater, others types described throughout thisapplication) to modify the internal environment (e.g., 104) of a chassisand/or information handling system.

By doing so, embodiments of the invention may reduce the corrosion ofchassis and/or components within chassis while limiting powerconsumption for gas conditioning purposes (e.g., by granularly modifyingthe gases thereby not modifying the condition of gases that are not usedto thermally manage corrosion sensitive components). By doing so, thecomputing devices disposed within chassis (e.g., 100A) may be morelikely to meet their respective service life goals, have lower operationcosts (by limiting energy use for thermal conditioning of gases), and/orrequire fewer repairs during their respective service lives (e.g., dueto reduced numbers of premature failures due to corrosion).

To manage the internal environment (104) of the chassis, the chassis(100A) may include a chassis environmental manager (150). The chassisenvironmental manager (150) may provide environmental managementservices. Environmental management services may include: (i) obtaininginformation regarding the rates of corrosion of the chassis and/orcomponent within chassis, (ii) determining, based on the corrosionrates, whether service life goals are likely to be impacted by thecorrosion, (iii) modifying the operation (e.g., modifying operatingpoints) of environmental control components (152) and/or heatingcomponents to reduce corrosion and/or reduce the amount of powerconsumed for environmental management purposes, and/or (iv) communicateand/or control any number of heating components to reduce thecorrosiveness of the airflow within the chassis to a level that islikely to cause the components to meet their service life goals. Foradditional details regarding the chassis environmental manager (150),refer to FIG. 2.

While illustrated in FIG. 1.3 as a physical structure, as will bediscussed with respect to FIG. 2, the chassis environmental manager(150) may be implemented as a logical entity (e.g., a program executingusing the computing components (140)). For example, a computing devicedisposed in the chassis (or other locations) may host an application(e.g., executable computer instructions being executed by a processor)that provides the functionality of the chassis environmental manager(150).

To enable the chassis environmental manager (150) to provide itsfunctionality, the chassis (100A) may include one or more detectors(e.g., 154, 156). These detectors may enable the rates of corrosion ofvarious components (e.g., portions of the chassis, computing components,etc.) to be determined and/or environmental conditions within and/orproximate to the chassis to be determined. These detectors may beimplemented as sensors or other types of physical devices that areoperably connected to the chassis environmental manager (150). Anynumber of corrosion detectors (e.g., 154), temperature detectors (e.g.,156), humidity detectors (e.g., 156), and/or other types of detectorsmay be disposed at any number of locations throughout the chassis(100A).

In some embodiments of the invention, the functionality of a temperaturedetector may be provided by, in all or in part, the computing components(140). For example, the computing components (140) may includefunctionality to report their respective temperatures and/or humiditylevels of the internal environment (104) of the chassis (100A).

The chassis (100A) may also include environmental control components(152). The environmental control components (152) may include physicaldevices that include functionality to modify characteristics (e.g.,temperature, humidity level, airflow rates/directions) of the internalenvironment (104) of the chassis (100A). The chassis (100A) may includeany number of environmental control components disposed at any number oflocations within the chassis.

For example, the environmental control components (152) may include gasmovers such as fans. The fans may be able to modify the rate of gasesbeing taken into and expelled from the chassis (100A) through the airexchangers (e.g., 142, 144). The rate of intake and exhaust of gases maycause an airflow to be generated within the internal environment (104).The airflow may be used to modify the rate of thermal exchange betweenthe computing components (140) and the internal environment (104) (e.g.,an environment proximate to the computing components (140)).

As an additional example, the environmental control components (152) mayinclude components that are not disposed in the chassis (not shown). Forexample, the environmental control components may include an airflowconditioner discussed with respect to FIG. 1.2. These externalcomponents may be used in conjunction with the environment controlcomponents disposed within the chassis to manage the temperature and/orrelative humidity levels throughout the internal environment (104) ofthe chassis as well as those of gases as they are taken into and/orexpelled by the chassis (100A). However, the use of airflow conditionersor other macro-level airflow conditioners may be avoided due to thelower level of discrimination available for conditioning gases usingsuch devices.

The chassis (100A) may include any number and type of environmentalcontrol components without departing from the invention. Any of theenvironmental control components may be implemented using physicaldevices operably connected to and/or controllable by the chassisenvironmental manager (150) and/or a system environmental manager (e.g.,130, FIG. 1.2) (alone or in combination). Any number of chassisenvironmental managers and system environmental managers maycooperatively operate to control the temperature and/or relativehumidity levels to control the rate of corrosion occurring within thechassis and/or manage the thermal load generated by the computingcomponents (140) and/or other components.

To cooperatively operate, the chassis environmental managers, theinformation handling system environmental managers, and the systemenvironmental managers may be operably connected to each another (e.g.,via wired and/or wireless networks). The aforementioned components mayshare information with one another (e.g., detector data, operating setpoints of different environmental control components, etc.). Thesecomponents may implement any type of model for controlling and/ordelegating control of the system for temperature, relative humiditylevel, and/or corrosion rate management purposes. When providing theirrespective functionalities, these components may perform all, or aportion, of the method illustrated in FIG. 3. Additionally, anycapability and functionality described herein with respect to anyspecific environmental manager may be performed by any of the disclosedenvironmental managers (i.e., the chassis environmental managers, theinformation handling system environmental managers, and the systemenvironmental managers). Any of these components may be implementedusing a computing device. For additional details regarding computingdevices, refer to FIG. 4.

While the chassis (100A) of FIG. 1.3 has been illustrated as including alimited number of specific components, a chassis in accordance with oneor more embodiments of the invention may include additional, fewer,and/or different components without departing from the invention.Additionally, while the chassis (100A) is illustrated as having aspecific form factor (e.g., rack mount), a chassis in accordance withembodiments of the invention may have different form factors withoutdeparting from the invention.

As discussed above, the chassis (100A) may include one or more chassisheater(s) (e.g., disposed where gases enter an information handlingsystem, etc.) and/or other types of heating components. The chassisheater may be used to reduce the impact of corrosive materials in gases(e.g., by increasing temperature of the gas and reducing its relativehumidity). Consequently, components exposed to the gases may corrode atreduced rates when compared to gases that have not been thermallyconditioned.

Turning to FIG. 1.4, FIG. 1.4 shows a diagram of a side view of aninformation handling system. In one or more embodiments of theinvention, airflow (172) is forced into the information handling system(10) via the information handling system heater (196.3). Specifically,in one or more embodiments of the invention, a door (112) is placed onthe front side of the information handling system (10) (i.e., the sidewhere airflow (172) enters the information handling system (10)), withan opening through an information handling system heater (196.3).Accordingly, most airflow that enters information handling system (10)must pass through the information handling system heater (196.3) beforepassing through one or more chassis (100A, 100B, 100C).

In one or more embodiments of the invention, the information handlingsystem heater (196.3) add energy to the gases that flow through theinformation handling system heater, thereby increasing the gastemperature and the capacity of the gas to retain water. Accordingly,the relatively humidity of the gas is lowered, the gas is less likely torelease water onto surfaces over which the gas is exposed. Specifically,in one embodiment of the invention, the information handling systemheater (196.3) may be a heat exchanger that includes a resistive elementthat adds energy to airflow (172) that contact the inner surfaces of theinformation handling system heater (196.3). As the airflow is heatedwhen entering the information handling system (10), all airflowtraversing each chassis (100A, 100B, 100C) is at a reduced relativehumidity than as it existed prior to being heated and flowing throughthe larger building.

While the information handling system (10) is illustrated in FIG. 1.4 asincluding a single information handling system heater (196.3), aninformation handling system (10) may include any number of informationhandling system heaters. These information handling system heaters maythermally condition airflows directed towards any number of the chassisof the information handling system. For example, the informationhandling system (10) may include airflow directing components such asducting that directs airflows from the respective information handlingsystem heaters to the corresponding chassis. Consequently, differentinformation handling system heaters may be capable of selectivelyheating airflows provided to different subsets of the chassis of theinformation handling system. Accordingly, the various airflows may bethermally conditioned to different standards. Thus, chassis that includecomponents that are more sensitive to corrosion may be provided airflowsthat are thermally conditioned to a higher standard than other airflowsprovided to chassis that include other components that are lesssensitive to corrosion.

In addition to the information handling system heaters that maythermally conditioning gases at a multi-chassis level, an informationhandling system may include heating components that thermally conditionairflows on a per chassis-level and/or components level. FIG. 1.5 showsa top view diagram of a chassis (100) that manages corrosion on amulti-component level (e.g., all of the components with a chassis or aportion of the components within a chassis) in accordance withembodiments of the invention. As discussed above, corrosion managementcomponents (e.g., heating components) may be utilized to locally managecorrosion (e.g., on a per component level where a corrosion managementcomponent only provides corrosion management services for one or morecorresponding components) or to manage corrosion on a multi-componentlevel.

The chassis (100) may house computing components including, for example,a processor (192.2), memory modules (192.4), and traces (192.6) thatinterconnect the processor and memory modules. Each of these computingcomponents may be subject corrosion.

To perform their respective functionalities, each of these computingcomponents may generate heat when providing their functionality. Tomanage the heat generated by these components, the chassis (100) mayinclude fans (194.2). The fans (194.2) may generate an airflow (194.6)that extracts the heat generated by the computing components.

For example, the airflow (194.6) may draw in gases from an air source(e.g., gases outside and surrounding the chassis (100) and informationhandling system) into the chassis (100) through the air receivingexchange (102.2). The gases may be at a lower temperature than theprocessor, traces, and/or memory modules. The gases may pass proximateto the processor, memory modules, and traces to cause thermal exchangewith the gases. After thermal exchange, the gases may be expelled out ofan air exhausting exchange (102.4). By doing so, the interior of thechassis (100) may be cooled to maintain the temperature of the processorand memory modules within nominal ranges.

However, the airflow (194.6) may include humidity. Depending on therelative humidity level due to the humidity, the airflow (194.6) maycause the computing component to corrode at unacceptable rates (e.g.,rates that are likely to lead to a premature failure of the computingcomponents).

The chassis (100) may include a chassis heater (196.4) to manage thehumidity of the airflow (194.6). The heater (196.4) may be managed by anenvironmental manager to preferentially heat the airflow (194.6) whenthe airflow (194.6) is likely to cause the computing components tocorrode at unacceptable rates.

For example, the chassis heater (196.4) may be operated during periodsof time where the computing components are idling thereby placing themat low temperature (which may, in turn, induce condensation on thesurfaces of the components). In contrast, when at elevated temperatureduring high workload periods, even large amounts of humidity entrainedin the airflow (194.6) may not result in significant corrosion of thecomputing components because the humidity may be unlikely to condense onthe components. To determine when the computing components are at lowertemperatures, the chassis (100) may include one or more detectors (191)used to measure the temperature of these components.

If the chassis heater (196.4) is implemented as a heat exchanger, theheat exchanger may be thermally coupled to a thermal manager (192.8)disposed on a processor (192.2) (or other type of component that islikely to generate large amounts of heat) using heat pipes (196.6). Inone or more embodiments of the invention, the thermal manager (192.8) isa heatsink that removes heat from the processor using one or moreactivate and/or passive components. The thermal manager (192.8) mayselectively extract heat generated by the processor (192.2) and transmitthe extracted heat to the heat exchanger by way of the heat pipes. Theamount of heat extracted by the thermal manager (192.8) may becontrolled by the environmental manager thereby enabling theenvironmental manager to selectively heat the heater (196.4) using heatgenerated by the processor (192.2) and transferred into the airflow(194.6). Examples of a thermal manager (192.8) include fins (one or moreelongated and conductive structures that protrude into the surroundingfluid), cavities (indentations and/or holes allowing a surrounding fluidto fill the interstitial space of those cavities), plates (flat surfacesexposed to the surrounding fluid), and/or vapor chambers/heat pipes(that include an internal porous wick and a fluid that cyclicallytransitions from liquid to gas and back to liquid while removing heatfrom a thermally coupled component).

The chassis heater (196.4) may cause the airflow (194.6) to be at anelevated temperature while one or more of the components are also atelevated temperature. Consequently, the airflow (194.6) may be less ableto cool components that are at elevated temperature. The thermal manager(192.8) may extract heat from other components without departing fromthe invention.

If the chassis heater (196.4) is implemented as a heater (e.g., aresistive heater), the heater may perform the same functionality asdiscussed above with respect to the heat exchanger. However, the heatermay selectively generate heat as directed by an environmental managerrather than obtain the heat from other components.

While the chassis (100) of FIG. 1.5 has been illustrated as including alimited number of specific components, a chassis in accordance with oneor more embodiments of the invention may include additional, different,and/or fewer components without departing from the invention. Forexample, the memory modules (192.4) may be disposed in connectors thatinclude corrosion management materials. In another example, discretecorrosion management components may be disposed proximate to the traces(192.6).

Additionally, while the chassis heater (196.4) illustrated as acomponent that heats all of the airflow (194.6) received by the chassis(100), a chassis heater in accordance with embodiments of the inventionmay more granularly heat airflows without departing from the invention.For example, the width of the chassis heater (196.4) in FIG. 1.5 may bereduced. By doing so, only a portion of an airflow taken into thechassis (100) may be heated by the chassis heater. By doing so, thechassis heater may be adapted to granularly heat airflows within thechassis. Consequently, the temperatures of different portions ofairflows within the chassis may be adjusted on a granular level.Accordingly, the thermal conditioning provided by the chassis heater(196.4) may be tailored based on the corrosion sensitivity of componentsdownstream from it within the chassis.

Additionally, a chassis (100) in accordance with embodiments of theinvention may include any number of chassis heaters. Consequently,different portions of the airflow within a chassis may be thermallyconditioned to different standards. The standards may be set based onthe corrosion sensitivity of components downstream from the respectivechassis heaters.

Like the information handling system heater disposed in the door of theinformation handling system as discussed in FIG. 1.1 and FIG. 1.4, thechassis heater (196.4) may provide similar functionality. However,rather than managing temperature of airflow for a single chassis likethe chassis heater (196.4), the information handling system heater ofthe information handling system may do so for multiple chassis and allof the corresponding components disposed therein.

A chassis in accordance with embodiments of the invention may also, oralternatively, thermally condition airflows by recirculating airflowswithin the chassis (and/or at an information handling system level).FIG. 1.6 shows a top view diagram of a chassis that includes airflowmanagement using recirculation in accordance with one or moreembodiments of the invention.

In one or more embodiments of the invention, chassis (100) may includeone or more fans (194.2) that pull in airflow (194.6) from outside ofthe chassis (100). The airflow (194.6) is then forced over the surfaceof components within the chassis (100). That is, fans (194.2) may beused to force the convection (i.e., thermal exchange via surroundingfluidic matter) on one or more devices (e.g., 192.2, 192.4) therebyexpediting the rate at which that device is brought to an equilibriumtemperature. One of ordinary skill in the art, having the benefit ofthis detailed description, would appreciate the process of expeditingthermal exchange via the use of a fan (194.2).

Further, in one or more embodiments of the invention, the airflow(194.6) is at an increased temperature after removing heat from thesurface of chassis components (e.g., processor (192.2), memory modules(192.4)). Accordingly, heated airflow (194.6) is generated in thechassis by virtue of normal operation of the fans (194.2) and forcedconvection (e.g., downstream from the devices (e.g., 192.2, 192.4) whichwere subject to forced convection). As such, as shown in FIG. 1.6,return fans (194.3) may be disposed near the sides of the chassis wherethe airflow (194.6) exits the chassis (100) to recirculate the heatedairflow.

In one or more embodiments of the invention, the return fans (194.3)recapture some of the heated airflow (194.6) (e.g., a sub-portion of theportion of the airflow traversing through the chassis (100)) and forcethat heated airflow (194.6) down one or more return duct(s) (e.g., 193)(as returned airflow (194.7)) to the intake side of fans (194.2) as theentrance side of the chassis (100), thereby recirculating the portion ofthe airflow that is heated by the components in the chassis.Consequently, the returned airflow (194.7) is hotter (i.e., at a highertemperature) than the airflow (194.6) taken in from the exterior of thechassis (100). Accordingly, the hotter returned airflow (194.7) may bepassed back through fans (194.2) and across internal chassis components(e.g., processor (192.2), memory modules (192.4)) thereby providinghotter airflow (e.g., the returned airflow and airflow may mix upstreamof the components (e.g., 192.2, 192.4) resulting in the mixed airflowhaving a higher temperature than that obtained through an air receivingexchange) with a lower relative humidity and therefore less likely tocause corrosion or cause lower rates of corrosion.

In one or more embodiments of the invention, the return fans (194.3) areactivated by a chassis environmental manager (not shown) when adetermination is made that one or more chassis components are at risk ofcorroding due to unconditioned airflow (194.6) having a temperature,(actual) humidity, and/or relative humidity that indicates corrosion islikely. The determination may be made based on measurements of thetemperature, (actual) humidity, and/or relative humidity taken by one ormore sensors (not shown) disposed within the chassis (100). Similarly,the chassis environmental manager may deactivate the return fans (194.3)based on a determination that one or more internal chassis componentsare no longer at risk of corroding due the air flowing throughout thechassis (100).

While the chassis (100) of FIG. 1.6 has been illustrated as including alimited number of specific components, a chassis in accordance with oneor more embodiments of the invention may include additional, different,and/or fewer components without departing from the invention. Forexample, the return fans (194.3) may be disposed in different positionsthat allow for the airflow to returned nearer to the airflow entrance ofthe chassis (100).

FIG. 1.7 shows a top view diagram of a chassis that includes airflowmanagement that also include recirculation in accordance with one ormore embodiments of the invention.

In one or more embodiments of the invention, chassis (100) may includeone or more fans (194.2) that pull in airflow (194.6) from outside ofthe chassis (100). The airflow (194.6) is then forced over the surfaceof components within the chassis (100). Accordingly, the airflow (194.6)is at an increased temperature after removing heat from the surface ofchassis components (e.g., processor (192.2), memory modules (192.4)).Accordingly, heated airflow (194.6) is generated in the chassis byvirtue of normal operation of the fans (194.2) and forced convection.

As shown in FIG. 1.7, return fans (194.3) may be disposed in the chassisto redirect some or all of the airflow (194.6) as returned airflow(194.7). In one or more embodiments of the invention, the return fans(194.3) recapture some of the heated airflow (194.6) and pull thatreturned airflow (194.7) in the opposite direction forced by fans(194.2) (or enable a return airflow to be generated by reducing orstopping their operation rather than actively generating the returnedairflow (194.7)). However, the returned airflow (194.7) is hotter (i.e.,at a higher temperature) than the airflow (194.6) taken in from theexterior of the chassis (100). Accordingly, the hotter returned airflow(194.7) may be pulled back over the internal chassis components (e.g.,processor (192.2), memory modules (192.4)) thereby providing hotterairflow with a lower relative humidity (and therefore less likely tocorrode).

Further, as shown in FIG. 1.7, the return fans (194.3) may be disposedat the exterior sides of the chassis (100) and/or in line with memorymodules (192.4). Accordingly, incoming external airflow (194.6) may bedirected down a center of the chassis (100) while hotter returnedairflow (194.7) is directed towards the chassis components disposednearer the exterior of the chassis (100) (e.g., memory modules (192.4).However, the return fans (194.3) may be disposed at the center of thechassis (100) with the fans (194.2) disposed at the edges of the chassis(100), where the return fans (194.3) are configured to pull hotterreturned airflow (194.7) over different chassis components withoutdeparting from embodiments of this invention.

In one or more embodiments of the invention, the return fans (194.3) areactivated by a chassis environmental manager (not shown) when adetermination is made that one or more chassis components are at risk ofcorroding due to untreated airflow (194.6) having a temperature,(actual) humidity, and/or relative humidity that indicates corrosion islikely. The determination may be made based on measurements of thetemperature, (actual) humidity, and/or relative humidity taken by one ormore sensors (not shown) disposed within the chassis (100). Similarly,the chassis environmental manager may deactivate the return fans (194.3)based on a determination that one or more internal chassis componentsare no longer at risk of corroding due the air flowing throughout thechassis (100).

While the chassis (100) of FIG. 1.7 has been illustrated as including alimited number of specific components, a chassis in accordance with oneor more embodiments of the invention may include additional, different,and/or fewer components without departing from the invention. Forexample, the return fans (194.3) may be disposed in different positionsof the chassis (100) without departing form the scope of this embodimentof the invention.

FIG. 2 shows a diagram of an environmental manager (200) in accordancewith one or more embodiments of the invention. The information handlingsystem environmental manager (119), the system environmental manager(130), and/or chassis environmental manager (150) illustrated in FIGS.1.1, 1.2, and 1.3, respectively, may be similar to the environmentalmanager (200).

As discussed above, the environmental manager (200) may provideenvironmental management services. Environmental management services mayreduce the likelihood that IHSs fail prematurely (e.g., prior to meetingservice life goals) due to corrosion.

In one or more embodiments of the invention, the environmental manager(200) is implemented using computing devices. The computing devices maybe, for example, mobile phones, tablet computers, laptop computers,desktop computers, servers, distributed computing systems, embeddedcomputing devices, or a cloud resource. The computing devices mayinclude one or more processors, memory (e.g., random access memory), andpersistent storage (e.g., disk drives, solid state drives, etc.). Thepersistent storage may store computer instructions, e.g., computer code,that (when executed by the processor(s) of the computing device) causethe computing device to provide the functionality of the environmentalmanager (200) described through this application and all, or a portion,of the method illustrated in FIG. 3. The environmental manager (200) maybe implemented using other types of computing devices without departingfrom the invention. For additional details regarding computing devices,refer to FIG. 4.

In one or more embodiments of the invention, the environmental manager(200) is implemented using distributed computing devices. As usedherein, a distributed computing device refers to functionality providedby a logical device that utilizes the computing resources of one or moreseparate and/or distinct computing devices. For example, in one or moreembodiments of the invention, the environmental manager (200) isimplemented using distributed devices that include componentsdistributed across any number of separate and/or distinct computingdevices. In such a scenario, the functionality of the environmentalmanager (200) may be performed by multiple, different computing deviceswithout departing from the invention.

To provide environmental management services, the environmental manager(200) may include an environmental component manager (202) and a storage(204). Each of these components is discussed below.

The environmental component manager (202) may manage heaters (of thechassis or information handling system) and/or other environmentalcontrol components that may be used to control the characteristics(e.g., temperature, humidity level, airflow rates, quantities ofcorrosive materials included in gases used for thermal managementpurposes, etc.) of the environment within a chassis. To manage them, theenvironmental component manager (202) may (i) obtain informationregarding the environmental conditions including temperatures, humiditylevels, airflow rates, and/or corrosion rates, (ii) determine, using theenvironmental information, whether the IHS is likely to prematurely faildue to corrosion due to these conditions, (iii) if the IHS is likely tofail, modify the environmental conditions to reduce corrosion byactivating the chassis heater, the information handling system heater,and/or modifying the operation of environmental control components,and/or (iv) if the IHS is unlikely to fail, modify the operation ofenvironmental control components to reduce energy consumption used tocondition gases for thermal management purposes (e.g., at the cost ofpotentially increased rates of corrosion).

To obtain information regarding the environmental conditions, theenvironmental component manager (202) may request such information fromcomputing components (e.g., temperatures), detectors (e.g., corrosion,temperature, humidity, and/or other types of sensors), and/or othertypes of devices (e.g., components external to the chassis). Inresponse, the aforementioned components may provide the requestedinformation to the environmental component manager (202). Theenvironmental component manager (202) may store the aforementionedinformation as part of an environmental condition repository (208).

To ascertain whether an IHS is likely to prematurely fail due tocorrosion, the environmental component manager (202) may estimate atotal amount of corrosion of different portions of a chassis and/orcomponents disposed within a chassis that has likely occurred, estimatethe rate that corrosion will occur in the future, and use the previousamount and current rate to determine whether corrosion managementcomponents are able to continue to provide corrosion management servicessufficient to meet the service life goals of the IHS.

To generate the estimates, the environmental component manager (202) maytake into account the historical environmental conditions. For example,the environmental component manager (202) may use predictive models toestimate future corrosion of components based on historical rates ofcorrosion.

Utilizing these estimates, the environmental component manager (202) maydetermine whether the IHS is unlikely to meet its service life goal dueto corrosion. To make this determination, the environmental componentmanager (202) may utilize a lifecycle repository (212). The lifecyclerepository (212) may specify information that may be used to ascertainwhether a premature failure will occur based on corrosion.

For example, the lifecycle repository (212) may specify a total amountof corrosion that will cause various components (e.g., computingcomponents) to no longer be able to provide their respectivefunctionalities. Based on these corrosion amounts and the corrosionestimates, the environmental component manager (202) may ascertainwhether the any of these components will be unlikely to provide theirfunctionalities prior to the IHS meeting its service life goals.

If it is determined that the IHS will prematurely fail due to corrosion,the environmental component manager (202) may orchestrate activation ofthe chassis heater, information handling system heater, and/or otherheating components. The environmental components manager (202) may do soby sending an electronic message to the information handling systemenvironmental manager. In response, the information handling systemenvironmental manager may activate the chassis heater, informationhandling system heater, and/or other heating components. Consequently,the activated heaters may reduce the rates of corrosion by increasingtemperature (i.e., reducing relative humidity) from the internalenvironments of chassis.

When providing its functionality, the environmental component manager(202) may utilize the storage (204) by storing and using previouslystored data structures.

To provide the above noted functionality of the environmental componentmanager (202), the environmental component manager (202) may performall, or a portion, of the method illustrated in FIG. 3.

In one or more embodiments of the invention, the environmental componentmanager (202) may be implemented using a hardware device includingcircuitry. The environmental component manager (202) may be implementedusing, for example, a digital signal processor, a field programmablegate array, or an application specific integrated circuit. Theenvironmental component manager (202) may be implemented using othertypes of hardware devices without departing from the invention.

In one or more embodiments of the invention, the environmental componentmanager (202) is implemented using computing code stored on a persistentstorage that when executed by a processor performs all, or a portion, ofthe functionality of the environmental component manager (202). Theprocessor may be a hardware processor including circuitry such as, forexample, a central processing unit or a microcontroller. The processormay be other types of hardware devices for processing digitalinformation without departing from the invention.

In one or more embodiments disclosed herein, the storage (204) isimplemented using devices that provide data storage services (e.g.,storing data and providing copies of previously stored data). Thedevices that provide data storage services may include hardware devicesand/or logical devices. For example, storage (204) may include anyquantity and/or combination of memory devices (i.e., volatile storage),long term storage devices (i.e., persistent storage), other types ofhardware devices that may provide short term and/or long term datastorage services, and/or logical storage devices (e.g., virtualpersistent storage/virtual volatile storage).

For example, storage (204) may include a memory device (e.g., a dual inline memory device) in which data is stored and from which copies ofpreviously stored data are provided. In another example, storage (204)may include a persistent storage device (e.g., a solid state disk drive)in which data is stored and from which copies of previously stored dataare provided. In a still further example, storage (204) may include (i)a memory device (e.g., a dual in line memory device) in which data isstored and from which copies of previously stored data are provided and(ii) a persistent storage device that stores a copy of the data storedin the memory device (e.g., to provide a copy of the data in the eventthat power loss or other issues with the memory device that may impactits ability to maintain the copy of the data cause the memory device tolose the data).

The storage (204) may store data structures including an environmentalcondition repository (208), a corrosion rate repository (210), and alifecycle repository (212). Each of these data structures is discussedbelow.

The environmental condition repository (208) may include one or moredata structures that include information regarding the environmentalconditions associated with a chassis, a chassis heater, an informationhandling system heater, and/or another type of component (e.g., acomputing component). For example, when temperature, humidity, airflowrate, and/or corrosion data is read from a detector, the readinformation may be stored in the environmental condition repository(208). Consequently, a historical record of the environmental conditionsassociated with these components may be maintained.

The environmental condition repository (208) may include any type andquantity of information regarding the environmental conditionsassociated with these components. For example, the environmentalcondition repository (208) may include temperature sensor data fromdiscrete temperature sensors and/or temperature sensors integrated intocomputing components (and/or other types of devices). In anotherexample, the environmental condition repository (208) may includecorrosion rates obtained from discrete or integrated corrosion sensors(e.g., on board a circuit card). In a still further example, theenvironmental condition repository (208) may include airflow rate dataregarding the flow of gases within a chassis.

In addition to the sensor data, the environmental condition repository(208) may include spatial data regarding the relative locations of thesecomponents with respect to the locations of the detectors. For example,some of these components may be disposed away from the detectors.Consequently, it may not be possible to directly measure thetemperature, relative humidity level, airflow rates, and/or corrosion ofthese components. The spatial data may be used to estimate, usingmeasured temperatures and/or corrosion, the likely corrosion rates ofthese components.

The corrosion rate repository (210) may include one or more datastructures that include information regarding the rates at which variouscomponents have corroded. For example, the corrosion rate repository(210) may include tables associated with a chassis heater, aninformation handling system heater, chassis, and/or other types ofcomponents disposed in chassis. Each of these tables may include themeasured and/or estimated corrosion of these components.

The tables may also include the time at which the corrosion wasmeasured. Consequently, the rates of corrosion of these components maybe ascertained using the information included in the tables (e.g.,corrosion at time T1−corrosion at time T2/the different between T1 andT2).

The lifecycle repository (212) may include one or more data structuresthat include information regarding the desired life of an informationhandling system. For example, the lifecycle repository (212) may specifyhow much corrosion may occur with respect to different components (e.g.,portions of a chassis, computing components, etc.) before the respectivecomponents are likely to fail and/or the IHS is likely to fail due todownstream impacts (e.g., circulating corrosion products) of corrosion.The aforementioned information may be used in conjunction withdetermined corrosion rates and quantities of corrosion included in thecorrosion rate repository (210) to determine whether it is likely that acomponent, computing device, and/or IHS is likely to fail prior to itsdesired service life.

While the data structures stored in storage (204) have been described asincluding a limited amount of specific information, any of the datastructures stored in storage (204) may include additional, less, and/ordifferent information without departing from the embodiments disclosedherein. Further, the aforementioned data structures may be combined,subdivided into any number of data structures, may be stored in otherlocations (e.g., in a storage hosted by another device), and/or spannedacross any number of devices without departing from the embodimentsdisclosed herein. Any of these data structures may be implemented using,for example, lists, table, linked lists, databases, or any other type ofdata structures usable for storage of the aforementioned information.

While the environmental manager (200) of FIG. 2 has been described andillustrated as including a limited number of specific components for thesake of brevity, an environmental manager in accordance with embodimentsof the invention may include additional, fewer, and/or differentcomponents than those illustrated in FIG. 2 without departing from theinvention.

Further, any of the components may be implemented as a service spanningmultiple devices. For example, multiple computing devices housed inmultiple chassis may each run respective instances of the environmentalcomponent manager (202). Each of these instances may communicate andcooperate to provide the functionality of the environmental componentmanager (202).

As discussed above with respect to FIG. 2, the environmental manager(200) may provide corrosion management services. FIG. 3 illustrates amethod that may be performed by the environmental manager (200) of FIG.2 when providing corrosion management services.

FIG. 3 shows a flowchart of a method in accordance with one or moreembodiments of the invention. The method depicted in FIG. 3 may be usedto manage a chassis environment in accordance with one or moreembodiments of the invention. The method shown in FIG. 3 may beperformed by, for example, a chassis environmental manager (e.g., 150,FIG. 1.3). Other components of the system illustrated in FIGS. 1.1-1.4may perform all, or a portion, of the method of FIG. 3 without departingfrom the invention.

While FIG. 3 is illustrated as a series of steps, any of the steps maybe omitted, performed in a different order, additional steps may beincluded, and/or any or all of the steps may be performed in a paralleland/or partially overlapping manner without departing from theinvention.

In step 300, a component subject to corrosion risk is identified. Thecomponent may be, for example, a computing component disposed within achassis. The component may be identified based on a listing or otherdata structure of components for which an environmental manager is toprovide environmental management services.

In step 302, a temperature associated with the component is monitored.The temperature associated with the component may be monitored using,for example, a sensor. The sensor may report the ambient temperatureadjacent to the component or a temperature from which the ambienttemperature adjacent to the component may be ascertained. The monitoringmay be performed for any duration of time.

The sensor may be integrated into the component or may be separate fromthe component. For example, if the component includes an integratedtemperature sensor, the component may provide the temperature associatedwith the component to an environmental manager.

In step 304, a humidity level associated with the component ismonitored. The humidity level associated with the component may bemonitored using, for example, a sensor. The sensor may report therelative humidity level adjacent to the component or a humidity levelfrom which the ambient temperature adjacent to the component may beascertained. For example, if the humidity level is known at a locationupstream from the component, the humidity level proximate to thecomponent may be determined based on modeling of the changes intemperature and humidity downstream of the measured location. Further,in some embodiments, if the humidity level and a temperature is knownupstream of the component and the temperature is known at the component,an accurate estimate of the relative humidity level at the component maybe ascertained based on the change in temperature between the locations.Like the monitoring of the temperature of step 302, the monitoring ofthe humidity level may be performed for any duration of time.

The sensor used to obtain the humidity level may be integrated into thecomponent or may be separate from the component. For example, if thecomponent includes an integrated humidity sensor, the component mayprovide the relative humidity level associated with the component to anenvironmental manager.

In step 306, a corrosion rate based on the temperature and humiditylevel is determined. The corrosion rate may be determined, as discussedwith respect to FIG. 3, using a corrosion rate repository that specifiesthe corrosion rate of the component as a function of temperature andrelative humidity level. In other words, a functional relationshipbetween corrosion rate and the combination of temperature and humiditylevel may be known for the component.

The aforementioned functional relationship may be ascertained vialaboratory measurement. For example, a component that may be subject tocorrosion risk may be exposed to different temperature and relativehumidity level ratios. The quantity of corrosion that occurred duringthe exposure may then be used to determine the corresponding corrosionrates for the component. The aforementioned relationships may be storedin storage of the environmental manager prior to it performing itsfunctionality disclosed herein.

In some embodiments of the invention, steps 302-306 may be performedusing a corrosion detector that directly measures a corrosion rate(rather than measuring temperature, humidity, and determining corrosionrate based on the temperature and humidity level). The detector mayinclude a sensor that directly measures rates of corrosion using anysensing methodology without departing from the invention.

In step 308, it is determined whether the corrosion rate indicates thata premature failure of the component is likely to occur based on theservice life of the component. The determination may be made bycomparing the amount of corrosion of the component that has occurred andthe corrosion rate to a maximum amount of corrosion that can occurbefore failure of the component is likely. In other words, solving theequation C_(f)=C_(c)+T*C_(r) where C_(f) is the amount of corrosion thatcan occur before premature failure is likely to occur, C_(c) is theamount of corrosion that has already occurred, C_(r) is the corrosionrate determined in step 306, and T is the unknown amount of time untilpremature failure will occur due to corrosion. If the amount of timeuntil premature failure indicates that failure of the component willoccur before the desired service life of the component occurs, it isdetermined that the corrosion rates indicates a premature failure of thecomponent will occur.

In one or more embodiments of the invention, the determination is madeby estimating the future rates of corrosion (and/or total amounts ofcorrosion) using a predictive model. The predictive model may be, forexample, machine learning, a stochastic method, a regression technique(e.g., linear regression/curve fitting), or any other method of usinghistorical data to predict future data.

The historical corrosion and/or corrosion rates obtained in step 306 maybe used as training data to train a predictive model. For example, theenvironmental conditions during a first period of time may be associatedwith rates of corrosion that occur in a second period of time in thefuture (e.g., a present to future relationship). Alternatively orcomplementary, the rates of corrosion during a first period of time maybe associated with rates of corrosion that occur in a second, futureperiod of time. These rates may be used as the training basis for thepredictive model.

The predictive model may be used to then predict the future levels ofcorrosion of the component based on the historical data (e.g., using thetrained model). The predicted future levels of corrosion may specify,for example, the amount of corrosion of the component at differentpoints in the future and/or the rates of change of the corrosion atdifferent points in time in the future based on environmental conditionsand/or rates of corrosion that have been measured.

These predictions may be used to ascertain when the corrosion risk ofthe component indicates a premature failure (e.g., whether the componentwill fail prior to meeting service life goals). If the component willnot meet is service life goals based on the prediction, the corrosionrisk may indicate the premature failure of the component.

If it is determined that a premature failure will occur, the method mayproceed to step 310. If not, it is determined that a premature failurewill not occur, and the method may end following step 308.

In step 310, an environmental control modification that mitigates thepremature failure is initiated. In one or more embodiments of theinvention, the environmental control modification is a command toinitiate a process that increases the temperature of the internalenvironment of the chassis. Generally, the rate of corrosion of acomponent increases greatly as the level of relative humidity increases(in the environment proximate to the component). Accordingly, the levelof relative humidity proximate to the component may be decreased by (i)increasing the temperature of the airflow or (ii) removing water vapor(i.e., moisture) from the airflow.

In one or more embodiments of the invention, the environmental controlmodification is to initiate activation of the chassis heater, theinformation handling system heater, and/or other heating components. Toinitiate activation of an information handling system heater, thechassis environmental manager sends a command (e.g., data) to theinformation handling system environmental manager to start theinformation handling system heater. In turn, upon receiving the commandfrom the chassis environmental manager, the information handling systemenvironmental manager activates the information handling system heaterwhich then begins heating the airflow. In one or more embodiments of theinvention, the information handling system environmental manager mayactivate the heater by initiating the flow of electrical power to theinformation handling system heater. In one or more embodiments of theinvention, the chassis environmental manager may directly control theinformation handling system heater, without interacting with theinformation handling system environmental manager and therefore mayperform some or all of the functions of the information handling systemenvironmental manager independently.

Similarly, to initiate activation of a chassis heater, the chassisenvironmental manager sends a command (e.g., data) to start the chassisheater. In one or more embodiments of the invention, the chassisenvironmental manager may activate the heater by initiating the flow ofelectrical power to the chassis heater. Alternatively, in one or moreembodiments of the invention, if the chassis heater is a heat exchangerthat is provided heat from one or more components of the chassis, one ormore heat pipes and/or other heat exchange elements may be utilized toheat the heater (thereby heating incoming airflow).

Other heating components may be activated in similar and/or differentmanners without departing from the invention.

In one or more embodiments of the invention, the environmental controlmodification is to initiate flow of returned airflow by a return fanand/or reverse fan (e.g., recirculate airflow within a chassis). In oneor more embodiments of the invention, the chassis environmental managermay activate a return fan and/or reverse fan by initiating the flow ofelectrical power to the return fan or reverse fan. Accordingly, onceactivated, hotter returned airflow begins to recirculate within thechassis (with a lower relative humidity).

In one or more embodiments of the invention, the environment controlmodification is implemented when the component's temperature, actualhumidity, and/or relative humidity exceeds a preferred temperaturerange. For example, when the component's measured (or calculated)relative humidity is likely to corrode the component, the environmentalcontrol modification may be implemented. As another example, if thecorrosion risk is determined to be low, an environmental manager inaccordance with embodiments of the invention may leave the chassisheater, information handling system heater, reverse fan(s), and/orreturn fan(s) in a (default) deactivated mode (e.g., inactive state).However, if the relative humidity is later measured/calculated to exceedthe nominal range, the chassis heater, information handling systemheater, reverse fan(s), and/or return fan(s) may then be activated(e.g., transitioned to an active state). Similarly, if the chassisheater and/or information handling system heater is currently active,and the chassis environmental manager measures/calculates that therelative humidity to be below a nominal threshold, the chassisenvironmental manager may deactivate, or initiate deactivation of, thechassis heater, information handling system heater, other heatingcomponents, and/or other components that may cause airflowrecirculation.

The method may end following step 310.

Embodiments of the invention may be implemented using a computingdevice. FIG. 4 shows a diagram of a computing device in accordance withone or more embodiments of the invention. The computing device (400) mayinclude one or more computer processors (402), non-persistent storage(404) (e.g., volatile memory, such as random access memory (RAM), cachememory), persistent storage (406) (e.g., a hard disk, an optical drivesuch as a compact disk (CD) drive or digital versatile disk (DVD) drive,a flash memory, etc.), a communication interface (412) (e.g., Bluetoothinterface, infrared interface, network interface, optical interface,etc.), input devices (410), output devices (408), and numerous otherelements (not shown) and functionalities. Each of these components isdescribed below.

In one embodiment of the invention, the computer processor(s) (402) maybe an integrated circuit for processing instructions. For example, thecomputer processor(s) may be one or more cores or micro-cores of aprocessor. The computing device (400) may also include one or more inputdevices (410), such as a touchscreen, keyboard, mouse, microphone,touchpad, electronic pen, or any other type of input device. Further,the communication interface (412) may include an integrated circuit forconnecting the computing device (400) to a network (not shown) (e.g., alocal area network (LAN), a wide area network (WAN) such as theInternet, mobile network, or any other type of network) and/or toanother device, such as another computing device.

In one embodiment of the invention, the computing device (400) mayinclude one or more output devices (408), such as a screen (e.g., aliquid crystal display (LCD), a plasma display, touchscreen, cathode raytube (CRT) monitor, projector, or other display device), a printer,external storage, or any other output device. One or more of the outputdevices may be the same or different from the input device(s). The inputand output device(s) may be locally or remotely connected to thecomputer processor(s) (402), non-persistent storage (404), andpersistent storage (406). Many different types of computing devicesexist, and the aforementioned input and output device(s) may take otherforms.

Embodiments of the invention may provide an improved method for managingcomponents of an information handling system. Specifically, embodimentsof the invention may provide a method and device for managing corrosionthat may cause components of an information handling system to fail. Todo so, embodiments of the invention may provide a system that includes aheating components used to thermally condition airflows that are used tothermally manage components. The heating components may reduce therelative humidity level of gases used for thermal management purposes byheating them. By doing so, corrosion of components thermally managedusing the gases may be reduced by reducing the corrosiveness of thegases.

Thus, embodiments of the invention may address the problem ofenvironments that may cause undesired corrosion. Specifically,embodiments of the invention may provide a method of managing corrosionthat enables less power to be consumed for environmental conditioningpurposes while still mitigating the impacts of corrosion by granularlythermally conditioning the gases.

The problems discussed above should be understood as being examples ofproblems solved by embodiments of the invention disclosed herein and theinvention should not be limited to solving the same/similar problems.The disclosed invention is broadly applicable to address a range ofproblems beyond those discussed herein.

One or more embodiments of the invention may be implemented usinginstructions executed by one or more processors of the computing device(400). Further, such instructions may correspond to computer readableinstructions that are stored on one or more non-transitory computerreadable mediums.

While the invention has been described above with respect to a limitednumber of embodiments, those skilled in the art, having the benefit ofthis disclosure, will appreciate that other embodiments can be devisedwhich do not depart from the scope of the invention as disclosed herein.Accordingly, the scope of the invention should be limited only by theattached claims.

What is claimed is:
 1. An information handling system comprising acomputing device, the information handling system comprising: acomputing component of the computing device that is housed in a chassis;and a heating component adapted to increase a temperature of a portionof an airflow when the heating component is in an active state, whereinthe portion of the airflow is adapted to thermally manage the computingcomponent by reducing a temperature of the computing component, whereinthe airflow is: received by the chassis via an air receiving exchange,and exhausted by the chassis via an air expelling exchange.
 2. Theinformation handling system of claim 1, further comprising: a chassisenvironmental manager programmed to: obtain a corrosion rate of thecomputing component; make a determination that the corrosion rateindicates a premature failure of the computing component based on aservice life of the computing component; and in response to thedetermination: initiate an environmental control modification using theheating component to mitigate the premature failure by reducing thecorrosion rate of the computing component.
 3. The information handlingsystem of claim 2, wherein initiating the environmental controlmodification comprises: transitioning the heating component from aninactive state to the active state, wherein the heating component is notadapted to increase the temperature of the airflow while in the inactivestate.
 4. The information handling system of claim 3, wherein thechassis environmental manager is further programmed to: after initiatingthe environmental control modification: make a second determination thata humidity level and a temperature associated with the computingcomponent are within a nominal threshold; and in response to the seconddetermination: transition the heating component to the inactive state.5. The information handling system of claim 1, wherein the heatingcomponent is further adapted to increase a second temperature of asecond portion of the airflow, wherein the second portion of the airflowis adapted to thermally manage a second computing component of a secondcomputing device housed in a second chassis when the heating componentis in the active state.
 6. The information handling system of claim 5,wherein the heating component is disposed in a portion of theinformation handling system through which the airflow traverses.
 7. Theinformation handling system of claim 1, wherein the heating componentcomprises: a chassis heater disposed adjacent to the air receivingexchange.
 8. The information handling system of claim 1, wherein theheating component comprises: a return fan adapted to obtain asub-portion of the portion of the airflow after the portion of theairflow has performed a thermal exchange with the computing component;and a return duct adapted to recirculate the sub-portion of the portionof the airflow by the computing component.
 9. The information handlingsystem of claim 1, wherein the computing component is a trace of acircuit card.
 10. The information handling system of claim 9, whereinthe corrosion rate is obtained using a humidity sensor integrated intothe computing component, wherein the computing component is operablyconnected to an integrated circuit.
 11. A method for environmentallymanaging an information handling system comprising a computing device,comprising: thermally managing, using a portion of an airflow, acomputing component of the computing device that is housed in a chassisby reducing a temperature of the computing component; and whilethermally managing the computing component, heating the portion of theairflow using a heating component that it is in an active state toincrease a temperature of the airflow, wherein the portion of theairflow is: received by the chassis via an air receiving exchange, andexhausted by the chassis via an air expelling exchange.
 12. The methodof claim 11, further comprising: obtaining, by a chassis environmentalmanager, a corrosion rate of the computing component; making, by thechassis environmental manager, a determination that the corrosion rateindicates a premature failure of the computing component based on aservice life of the computing component; and in response to thedetermination: initiating, by the chassis environmental manager, anenvironmental control modification using the heating component tomitigate the premature failure by reducing the corrosion rate of thecomputing component due to the portion of the airflow.
 13. The method ofclaim 12, wherein initiating the environmental control modificationcomprises: transitioning the heating component from an inactive state tothe active state, wherein the heating component is not adapted toincrease the temperature of the portion of the airflow while in theinactive state.
 14. The method of claim 13, further comprising: afterinitiating the environmental control modification: make a seconddetermination that a humidity level and a temperature associated withthe computing component are within a nominal threshold; and in responseto the second determination: transition the heating component to theinactive state.
 15. The method of claim 11, further comprising:increasing, using the heating component, a second temperature of asecond portion of the airflow while the second portion of the airflowthermally manages a second computing component of a second computingdevice housed in a second chassis while the heating component in theactive state.
 16. The method of claim 13, wherein the heating componentis disposed in a portion of information handling system through whichthe airflow traverses.
 17. A non-transitory computer readable mediumcomprising computer readable program code, which when executed by acomputer processor enables the computer processor to perform a methodfor environmentally managing an information handling system comprising acomputing device, the method comprising: thermally managing, using aportion of an airflow, a computing component of the computing devicethat is housed in a chassis by reducing a temperature of the computingcomponent; and while thermally managing the computing component, heatingthe portion of the airflow using a heating component that it is in anactive state to increase a temperature of the airflow, wherein theportion of the airflow is: received by the chassis via an air receivingexchange, and exhausted by the chassis via an air expelling exchange.18. The non-transitory computer readable medium of claim 17, wherein themethod further comprises: obtaining, by a chassis environmental manager,a corrosion rate of the computing component; making, by the chassisenvironmental manager, a determination that the corrosion rate indicatesa premature failure of the computing component based on a service lifeof the computing component; and in response to the determination:initiating, by the chassis environmental manager, an environmentalcontrol modification using the heating component to mitigate thepremature failure by reducing the corrosion rate of the computingcomponent due to the portion of the airflow.
 19. The non-transitorycomputer readable medium of claim 18, wherein initiating theenvironmental control modification comprises: transitioning the heatingcomponent from an inactive state to the active state, wherein theheating component is not adapted to increase the temperature of theportion of the airflow while in the inactive state.
 20. Thenon-transitory computer readable medium of claim 19, wherein the methodfurther comprises: after initiating the environmental controlmodification: making, by the chassis environmental manager, a seconddetermination that a humidity level and a temperature associated withthe computing component are within a nominal threshold; and in responseto the second determination: transitioning, by the chassis environmentalmanager, the heating component to the inactive state.